A wave of leaks points to an imminent Intel Nova Lake announcement: ASRock Z990 motherboards appeared in a supply database, and an HP EliteBook X with an unknown Intel chip appeared in SiSoftware. Intel CEO Lip-Bu Tan said the launch is planned for the second half of 2026.
Leaker Kepler_L2 said AMD’s DLSS 5 analogue with neural lighting will probably work only on RDNA 5 graphics cards due to the high computational load. AMD has not officially announced such a feature, and its research papers do not name a target GPU.
Backblaze analyzed over 341,000 hard drives in Q1 2026: models 20 TB and above had an annualized failure rate (AFR) of 0.85%, compared to 1.24% fleet-wide. The leader was WDC 22 TB with 0.38% AFR, while Toshiba 24 TB had 0.22%.
QNAP unveiled the TS-h966TX, a 9-bay NAS with five SATA bays and four U.2 NVMe slots, two Thunderbolt 4 ports, 10GbE and 2.5GbE. It runs QuTS hero on ZFS with a 6-core Intel Core i3, starts at $1299, and preorders are open.
TrendForce forecasts TSMC's CoWoS-L will stay the main 2.5D packaging method for AI chips through 2028 due to maturity and yield, despite Intel EMIB-T competition. Nvidia high-end GPU shipments are expected to grow about 30% YoY in 2026, while AMD will promote MI400/MI450 in H2 2026.
Ericsson and Finnish state company Erillisverkot demonstrated Integrated Sensing and Communication technology at the Helsinki cargo port. The 5G-based system analyzes radio signal reflections to detect small low-flying drones, combining data from multiple network points.
IQM Quantum Computers will deploy its Spark quantum computer at Brazil's Eldorado Research Institute in Campinas in Q1 2027. The institute also gets remote access to IQM's 54-qubit cloud system in Europe, IQM's first system in South America.
Piper Sandler analysts said Amazon, Apple, AMD, Google, Tesla, Microsoft, Nvidia and Qualcomm are evaluating Intel's 14A process. Defect density reached 0.5 in June 2026, with a target of 0.1-0.2 by Q1 2027; mass production is planned for Q1 2028.
Supply chain data indicates TSMC plans to grow CoWoS packaging output from about 130,000 300-mm equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not official company guidance but matches the direction of its expansion.
TSMC received approval for the third phase of Longan Park expansion in Hsinchu Science Park. The 104-acre site, costing about $3 billion, will host three plants, with the first starting mass production in 2030 for chips using a sub-1.4nm (A14) process.
The Humanoids Summit Seoul opens on September 22. Goldman Sachs forecasts that Korean manufacturers of NMC batteries and actuators will capture 30% of global humanoid robot production by 2035, thanks to a decade of development in high-nickel battery chemistry.
AI demand is pushing manufacturers to redirect capacity to more profitable memory, causing a sharp shortage of NOR Flash and SLC NAND. Contract prices rose over 100% in H1 2026, and SLC NAND may rise another 120–170% in H2.
ETH Zurich's Soft Robotics Lab trained a five-fingered robotic hand to move across 14 surface types, get up after falls, steer using onboard sensors, and press keys by supporting its weight on its own fingers. Training was done in simulation via reinforcement learning, with no separate locomotion mechanism needed.
Huawei Cloud will launch its commercial cloud service based on the Ascend 950 cluster in China on September 30, and globally on November 30. The system connects 1024 accelerators via UnifiedBus and delivers up to 1 EFLOPS in FP8 and 2 EFLOPS in FP4 with 256 TB of shared memory.
Prusa Research released the updated CORE One L+ 3D printer for $1999 — the same price as before. The upgrade adds a silicone nozzle-cleaning brush, GT1.5 belts and factory calibration, speeding up first print start to ~5 minutes.
Authorities in the Indian state of Odisha approved the creation of a National Integrated Power Electronics Hub at IIT Bhubaneswar worth Rs 452 crore. The project is funded by MeitY, the state government, ANRF and industry partners; a total of five semiconductor projects worth Rs 10,899 crore have been approved in the state.
Polish WB Group unveiled the Gladius 2 (Warmate 30) at the International Defense Industry Expedition 2026 — a jet-powered loitering munition with a stealth flying-wing design inspired by the B-2 bomber. The drone carries a 30 kg replaceable warhead and launches from the ground or a container; range and specifications were not disclosed.
Hardware Unboxed tested an OEM AMD Radeon RX 9050 with 4GB, comparing it to the 8GB version. The memory cut reduces the bus from 128 to 64 bits and Infinity Cache from 32 to 16MB, making the 8GB model 53% faster in 007 First Light at 1080p Low and 47% faster in Forza Horizon 6 at Medium.
IperionX confirmed the viability of its continuous GenX process based on HAMR technology for producing titanium powder for 3D printing. Energy consumption is reduced by over 75% versus batch HAMR and up to 90% versus the Kroll method; the goal is 1400 tons per year and $30 per kilogram.
Minisforum released the S5 NAS with fully passive cooling and five M.2 PCIe 4.0 x1 slots, allowing up to 40TB (5×8TB). It is based on a 5-core Intel Core 3 304 (15W) and includes two USB4, Wi-Fi 7, and 10GbE/2.5GbE ports. Price and release date not announced.
Ukrainian-Estonian company Ark Robotics is developing a system to control armies of robots and drones. Its technology is already deployed on the battlefield and rapidly improving, with plans to increase usage tenfold.
Industry analysts say rising spending on AI infrastructure will continue to cause DRAM shortages. The memory shortage may persist until 2027 and beyond.
Huawei Digital Power presented a solution for AI data centers that makes them a support for the power grid rather than a passive load. The package includes Taishan 1280 kVA UPS with 98% efficiency, Hengshan DC UPS supporting 270/400/800 V, PowerPOD 5.0, and the LUNA2000 system. The company proposes a 'tokens per watt' metric instead of PUE.
Caltech engineers developed a metasurface of amorphous silicon with nanoscale pillars that deflects a light beam with another beam in 74 femtoseconds — about the time light takes to travel through a human hair. The device uses the optical Kerr effect and deflects the beam at angles up to 13 degrees.
At Huawei Connect 2026 in Shanghai, Huawei announced the Atlas 960E SuperPoD, an industry-first cluster with close-packed optics featuring 4096 NPUs, 8 EFLOPS in FP8, and a petabyte of HBM. The Ascend 960DT processor will launch in Q1 2027, three quarters ahead of schedule, followed by 960PR, 970, and 980.
A Vulkan report revealed that Xiaomi's XRING 03 chip supports block-compressed BCn textures, which other SoCs with ARM Mali graphics lack. This removes a compatibility barrier and allows running Windows games via emulation, as on Snapdragon.
ASML will not adopt free-electron laser (FEL) technology for EUV generation, which is backed by Elon Musk. The company will continue developing laser-produced plasma (LPP) sources, increasing power from 500 to 1000W and boosting tin droplet rate to 100,000 per second.
Huawei presented its latest development for AI data centers, intensifying competition with Nvidia. The Chinese company is betting on semiconductors and AI infrastructure.
Researchers at Delft University of Technology created a tactile navigation system for microdrones: a pair of artificial "whiskers" with three pressure sensors at the base measures surface contact in three dimensions. Processing runs onboard and requires only 34 KB of memory. In tests the drone flew in total darkness, mapped rooms and found exits without cameras.
Samsung's Exynos share of the smartphone processor market reached 9% in the second quarter. Growth was driven by chips in the mid-range Galaxy A57 and A37 models.
