AI Chip Packaging Pushes Beyond Reticle Limits, CoWoS-L to Remain Mainstream Through 2028

TrendForce forecasts TSMC's CoWoS-L will stay the main 2.5D packaging method for AI chips through 2028 due to maturity and yield, despite Intel EMIB-T competition. Nvidia high-end GPU shipments are expected to grow about 30% YoY in 2026, while AMD will promote MI400/MI450 in H2 2026.

• CoWoS-L from TSMC to remain main AI chip packaging until 2028
• Nvidia GPU shipments to grow about 30% YoY in 2026
• AMD to promote MI400/MI450 in H2 2026
• Intel EMIB-T competes with CoWoS-L but lags in maturity and yield