TSMC CoWoS capacity to double by 2028, rivals still win orders

Supply chain data indicates TSMC plans to grow CoWoS packaging output from about 130,000 300-mm equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not official company guidance but matches the direction of its expansion.

• CoWoS capacity to grow from ~130,000 to 260,000 wafers per month
• Doubling expected by 2028
• Estimate is a supply chain forecast, not official TSMC guidance
• Rivals will also receive packaging orders