onsemi announced its Embedded Power Platform (EPP), an architecture where the silicon wafer forms the package base and combines silicon, SiC and GaN. The platform promises 3-5x higher power density; in a solid-state switch test the solution was 50% smaller and 20% cooler. Sampling for strategic customers starts in 2026, with Subaru among partners.
A HP EliteBook X G3i laptop with a 20-core Intel processor, likely from the Nova Lake family, was spotted in the SiSoftware database. It lists clock speeds of 3–4.6 GHz, 18 MB L3 cache, and four 4 MB L2 blocks.
AMD researchers published work on replacing global illumination with image generation: a one-step Stable Diffusion 2.1 Turbo model takes a direct-light frame and reconstructs indirect light. The method runs at 0.29 seconds per frame (about 3.45 fps) at 512×512 on an RTX 3090 and requires 8–9 GB of VRAM.
At Huawei Connect 2026, Huawei outlined its Ascend accelerator plans: the 960DT with 288 GB HBM and 2 PFLOPS FP8, the 960PR in Q3 2027, the Ascend 970 in 2028 and the Ascend 980 with 384 GB HBM in 2029. It also announced the Atlas 960E SuperPoD supernode with NPO optics for 4096 NPUs.
Northrop Grumman conducted an aeroballistic test of a new 50mm round for the Raid Hunter short-range air defense system, firing from an XM913 Chain Gun. Almost every shot provided accurate flight data that matched the company's predictions. The next stage is a guided round with a proximity fuze against drones and cruise missiles.
ASML, the sole supplier of EUV lithography systems, is gaining broader industry support for High-NA EUV, the next generation of lithography for printing smaller and denser circuits. The company is strengthening control over the advanced chipmaking segment.
Agility Robotics showed Digit 5, a 180 cm, 129 kg humanoid for warehouses and manufacturing. Payload rose 40% to 23 kg, and a 9-minute charge provides 90 minutes of work. Early access is planned for the first half of 2027, with production at RoboFab at up to 10,000 robots per year.
According to AM Research, global additive manufacturing revenue in metal, polymer and ceramic reached $4.48 billion in Q2 2026, up 12% year-over-year. Growth has continued for six consecutive quarters.
Arm introduced Arm Total Design for Physical AI, a program uniting more than 80 companies in physical AI, from chips to robotics. It also announced a Robotics Capability Framework with six levels of robot autonomy.
China's Sugon 8000 is a leading weather forecasting system built on 100,000 domestically developed AI chips. Details on performance and launch timing were not disclosed.
BAE Systems received $16 million in defense funding to demonstrate and qualify its 45nm radiation-hardened RH45 technology. Chips will be made at GlobalFoundries' Malta, New York fab using SOI, with final assembly and test in Manassas, Virginia.
The world's first underwater drone mothership has been shown, featuring a 12-section cradle hangar that holds up to four small underwater vehicles. The platform is designed to launch and service submarines underwater.
Apple executives detailed the 2nm A20 Pro processor: CPU 20% faster, GPU 40% faster. The chip features a doubled neural engine, side-mounted DRAM and MCM packaging, plus contact with a vapor chamber for better cooling.
The University of Maine unveiled the 30-foot 3D-printed 3Dirigo X boat with a print speed of 500 pounds per hour. AEVEX and Divergent will jointly develop adaptive drones on the DAPS system. China's Tripo AI raised about 3 billion yuan in B and B+ rounds and showed the Tripo P2.0 model.
Samsung Display announced a new M16 OLED panel with peak brightness of 10,000 nits. The panel is used in the iPhone Duo, iQOO 16, and is likely to appear in the Galaxy S27 Pro.
HPE released Alletra MP X10000 Release 4: nodes and JBOFs increased from 8 to 16, maximum capacity grew from 11.8 to about 23 PB, and NFS file system was added to object storage. RDMA and Nvidia GPU Direct for KV cache are now supported.
Applied Materials announced a $5 billion (₹47,980 crore) investment under the India Vision 2035 program at SEMICON India 2026. The funds over 10 years will go to R&D, a 140-acre research park, and a tenfold growth of the local supply chain by 2035.
South Korea's National Research Service for Parliament questioned the stability of water supply for the Honam chip complex. The complex needs about 650,000 tons of industrial water per day, but annual dam inflow fluctuations reach +84% and -72.2%.
Taiwan and Vietnam customs records for July 2027 show five ASRock motherboards with the Z990 chipset for Intel's Nova Lake platform (LGA1954). Models include Z990 Challenger WiFi, Z990 Pro RS WiFi, Z990 Steel Legend WiFi, and two Taichi boards. Z990 will be the flagship chipset, with Z970 as a cheaper alternative with multiplier overclocking.
Tower Semiconductor and NewPhotonics announced the start of mass shipments of photonic integrated circuits (PICs) with integrated lasers for AI interconnect. The NPG102 chips support 800G and 1.6T speeds, with shipments of 6.4T NPC505 solutions planned for the first half of 2027.
MediaTek launched the Dimensity 9600M chip: hardware-wise it is a repackaged Dimensity 9500 on TSMC's 3nm N3P process with the same C1-Ultra cores up to 4.21 GHz, Mali-G1 Ultra MC12 GPU and APU 990 NPU. It gains the Agentic AI Engine and Dimensity Scheduling Engine from the flagship 9600 Pro. First smartphones on the 9600M — vivo X500 and Oppo Find X10 — are expected this quarter.
SK hynix presented processing-in-memory (PIM) technology at the AI Infra Summit in Santa Clara. VP Im Il-chol said PIM offers 300 times more capacity than SRAM on the same area, with area limits addressed by hybrid bonding.
France's Alice & Bob and the French Alternative Energies and Atomic Energy Commission (CEA) agreed to jointly develop software enabling quantum computers to work with classical supercomputers. The project builds on Bull's Qaptiva platform and aims to compete with Nvidia CUDA-Q; an Alice & Bob quantum computer will be installed at CEA in 2027.
YouTuber GizmoSlipTech, using a mod created by PREMO via vibe coding, raised the power limit of a laptop RTX 5090 in an XMG Neo 16 from 175W to 250W. In 3DMark Steel Nomad, the gain was 41.6%, and in games up to 29.7% FPS, but an external Oasis water cooling system was required.
SK Hynix presented PIM, HBF, and SALT-KV technologies at the AI Infra Summit 2026 in Santa Clara. The company is expanding its memory strategy beyond the GPU-HBM pairing, targeting the growing diversity of inference workloads.
AMD is preparing a price increase of about 10% on GPUs, motherboard chipsets, and possibly CPUs due to rising TSMC wafer costs. Motherboard manufacturers will have to adjust prices following chipsets.
Scientists of the AM2SoftMag project developed an iron-based metallic alloy for laser 3D printing (LPBF) that retains an amorphous structure. The material, free of phosphorus, cobalt, and rare earth elements, has coercivity of 44–77 A/m and a critical thickness of about 1 mm.
At SEMICON Taiwan 2026 Samsung presented a shift from 2.5D to 3D memory integration via vertically stacked zHBM. The goal is to raise AI response throughput from about 100 to 1000 tokens per second per user.
China's largest DRAM maker ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profit and greater pricing power. This gives the company resources to expand into LPDDR6 and high-speed HBM memory.
TSMC is reconsidering its plan to donate 12-inch equipment as Taiwan authorities change the framework of a joint semiconductor project, and the National Science and Technology Council has not yet approved the 2027 budget.
