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HardwareSeptember 17, 2026, 20:25

Huawei Details Ascend 960, 970 and 980 AI Chips Through 2029

At Huawei Connect 2026, Huawei outlined its Ascend accelerator plans: the 960DT with 288 GB HBM and 2 PFLOPS FP8, the 960PR in Q3 2027, the Ascend 970 in 2028 and the Ascend 980 with 384 GB HBM in 2029. It also announced the Atlas 960E SuperPoD supernode with NPO optics for 4096 NPUs.

Huawei Details Ascend 960, 970 and 980 AI Chips Through 2029
#Huawei#Ascend
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