Tower and NewPhotonics Ship Laser-Integrated PICs for AI Interconnect
Tower Semiconductor and NewPhotonics announced the start of mass shipments of photonic integrated circuits (PICs) with integrated lasers for AI interconnect. The NPG102 chips support 800G and 1.6T speeds, with shipments of 6.4T NPC505 solutions planned for the first half of 2027.
- NPG102 PICs operate at 200 Gb/s per lane and use heterogeneously integrated lasers
- Mass shipments cover FRO/LRO/LPO, XPO, and NPO modules
- NPC505 chipsets for 6.4T will begin shipping in the first half of 2027
- Products are built on Tower's PH18DA silicon photonics platform
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