onsemi announces Embedded Power Platform for AI-era power design

onsemi announced its Embedded Power Platform (EPP), an architecture where the silicon wafer forms the package base and combines silicon, SiC and GaN. The platform promises 3-5x higher power density; in a solid-state switch test the solution was 50% smaller and 20% cooler. Sampling for strategic customers starts in 2026, with Subaru among partners.

• EPP embeds heterogeneous dies in silicon, connected via redistribution layers
• Claimed power density 3-5x higher than current solutions
• In a solid-state switch, 50% smaller and 20% cooler
• Sampling starts in 2026; Subaru is an early partner