Intel and AU Optronics May Merge Micro LED Displays With Silicon and CPO Packaging

Intel is reportedly partnering with Taiwan's AU Optronics to co-develop co-packaged optics and high-density chip integration on glass substrates with Micro LED. Intel declined to comment, but it recently secured a US patent covering IC packaging on Micro LED substrates using through-glass vias.

• Intel and AUO to target CPO and dense glass-substrate chip packaging
• Intel holds a US patent on IC packaging on Micro LED substrates with TGV
• AUO brings Micro LED, glass substrate, RDL and optical interconnect expertise
• Intel declined to comment; AUO previously confirmed advanced packaging push