U.S. companies VulcanForms and Specter Aerospace have partnered to create large-scale production of hypersonic air-breathing systems using metal 3D printing. The partnership will cover munitions, interceptors, and cruise missiles, including full assembly and integration. The location and cost of the future plant have not been disclosed.
A Reddit user discovered melting marks on the power connector of a Radeon RX 7900 XTX after months of black screens and unsuccessful diagnostics. The card draws about 400 W through an 8-pin connector, and the connection was made via a Thermal Grizzly WireView power monitor, which took the damage.
Finnish IQM has sold its second quantum computer, the Spark system, to Japan's Toyo Corporation. It will be installed at Toyo's R&D center in Tokyo, with launch expected in early 2027.
Germany's DDR5 price index rose from 486% to 544% year-over-year in September. A 2x16 GB DDR5-6400 CL30 kit increased 103% in a month, while 2x32 GB DDR5-6400 rose 33%. DDR4 prices stabilized.
According to Moore's Law is Dead, Nvidia is targeting H1 2027 for the RTX 60 series, including the RTX 6090, and has cancelled the RTX 50 SUPER lineup. Other insiders call the leak fake, citing memory shortages and rising component prices.
ASML has deployed High-NA EUV scanners at all four major chipmakers: TSMC, Samsung, SK Hynix and Intel. The company began construction of a new campus in Eindhoven to produce systems costing about $400 million; volume production is planned for 2028–2030.
An RTX 5090 Founders Edition owner reported that NVIDIA denied his warranty claim due to an unreadable serial number on the metal bracket. The user bought the card from the NVIDIA UK store and has the original box and receipt, but the company returned the GPU without explanation. Other RTX 5080 FE owners reported similar cases.
According to insider Jaykihn, Intel moved the desktop Nova Lake-S chip with 12 Xe3P GPU cores and a 4+8+4 CPU configuration to the Razor Lake generation, arriving a year after Nova Lake. The SKU supports DDR5-8000 via CSODIMM, PL2 around 40 W, with 65 W reserved for PL3/PL4.
Qualcomm and Samsung are in talks to produce Snapdragon 8 Elite Gen 6 at Samsung Foundry. The deal is not yet confirmed: Samsung's 2nm chip yield is around 55%, while Qualcomm requires about 70%.
Stratasys helped General Motors reduce production issue resolution times from weeks to hours using 3D printing. The company uses additive technologies to quickly manufacture parts and tooling at factories.
QNAP released the compact Thunderbolt 4 NAS TS-h966TX with hybrid storage: five SATA HDD bays and four U.2 PCIe NVMe for cache. The device runs on a 6-core Intel Core i3 with 8 GB DDR5 (up to 64 GB) and costs £1588/€1664, aimed at small studios and content creators.
Agility Robotics unveiled Digit 5, a humanoid robot with human-like legs, a 90-minute battery and 9-minute charging. It can work alongside people without safety barriers and lifts up to 22.7 kg. Early access is expected in the first half of 2027, with general availability by the end of 2027, including the EU and UK.
Nokia will supply Telxius with ICE-X 800G ZR/ZR+ coherent pluggable modules for terrestrial transport networks in Europe, the US, and Latin America. The IP-over-DWDM technology aims to increase capacity and reduce power consumption and footprint. The partners previously achieved 400 Gbps per wavelength over 5,600 km on the BRUSA submarine cable.
MediaTek launched the Dimensity 9600M chip for the base Vivo X500. It is nearly identical to last year's Dimensity 9500: the same TSMC N3P 3nm process, CPU with a 4.21 GHz C1-Ultra core, Mali-G1 Ultra MC12 GPU and APU 990 NPU. New features include Dimensity Scheduling Engine 3.0, Gemini Nano 4 and Qwen 3.5 Omni 4B support, and a gaming mode up to 185 fps.
XPeng is using its self-developed Turing AI chip not only in electric vehicles but also in humanoid robots. The IRON robots are equipped with about three Turing chips with a total performance of approximately 2250 TOPS, enabling local execution of the onboard Physical AI model.
Xi'an-based Blueworm Embodied released the Mantis Standard modular wheeled humanoid platform, priced from RMB 9,800. The robot has 22 degrees of freedom, 7 kg arm payload, under 10 ms teleoperation latency and about 3 hours of runtime per charge.
Quantum computers could eventually complement GPUs and CPUs on AI workloads, cutting costs and energy use. QuEra promises cloud access to a 256-qubit system in 2028, IBM a 200-qubit Starling in 2029, and SQC already sells QPUs for training AI models in finance, pharma and defense.
Murata Manufacturing is considering a new, larger expansion of multilayer ceramic capacitor (MLCC) production beyond current plans. The reason is expected high demand from AI servers that will persist until the end of the decade.
Comparison of Xiaomi's new Xring O3 chip with MediaTek Dimensity 9500 in benchmarks. Xring O3 outperforms the competitor by 7% in single-core Geekbench 6, 41% in multi-core, and 58% in 3DMark Wild Life Extreme.
MediaTek announced its flagship Dimensity 9600 Pro SoC on TSMC's 2nm process with 61% lower multi-core power consumption. The chip features a 2+3+3 CPU up to 4.55 GHz, LPDDR6 and UFS 5.0 support, and a dual NPU for models up to 30 billion parameters. First smartphones are expected this quarter.
Samsung Networks and Verizon conducted one of the first field trials of ISAC (integrated sensing and communication) technology on a live commercial 5G network in Dallas. The system, based on the Network in a Server platform, built a near-real-time crowd density heatmap from smartphone signal variations.
Semiconductor Engineering examines the problem of 'stranded' power in AI data centers: some servers run at elevated voltage while backup capacity sits idle. Solutions include IP block power management, DVFS, and power-gating at the NoC level.
Synopsys demonstrated a test chip where PCIe 6.0 at 64 GT/s with PAM4 operates in a 3D architecture with vertically stacked dies. Over 8 lanes, up to 128 GB/s is achieved, and bit error margin exceeds standard requirements by several orders of magnitude.
Fujitsu announced global sales of its FUJITSU-MONAKA processor starting November 2026. The 2nm 3D-stacked CPU runs up to 3.8 GHz with 8800 MT/s memory and doubles AI inference throughput. The Japan-built MONAKA Server targets data centers, defense and science.
AMD announced prices for two new desktop processors: Ryzen 5 7500 on AM5 for $189 and Ryzen 5 5500F on AM4 for $99. Both chips are 6 cores and 12 threads with 65 W TDP, aimed at budget builds.
According to Omdia, global semiconductor industry revenue grew 31% year over year in the second quarter to a record $425 billion. Growth was driven by demand for AI and data center chips.
