TSMC-GF deal shifts mature nodes into AI packaging

TSMC and GlobalFoundries are expanding the market for mature process nodes serving advanced AI packaging. GlobalFoundries won a US$2 billion interposer order from TSMC, closing a US packaging gap.

• GlobalFoundries won a US$2 billion interposer order from TSMC
• TSMC locked in 3-6% wafer price hikes for 2027
• Mature nodes are increasingly used in AI chip packaging