Hardware1 hSeptember 29, 2026, 10:59

Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's IME, KLA, ASM International, NUS, the SHINE Centre and ASMPT discussed the shift in advanced packaging from discrete components toward system integration. The AI boom has renewed appeal for semiconductor careers.

Digitimes

Open source

Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

Innovate Together 2026 conference held in Singapore on September 25
Participants included A*STAR IME, KLA, ASM International, NUS, SHINE Centre and ASMPT
Advanced packaging is moving toward system integration
AI boom renews interest in semiconductor talent

#A*STAR#KLA#ASMPT#NUS

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Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

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