Beyond 16 layers: HBM stacks test advanced packaging equipment makers

At Singapore's Innovate Together 2026 conference on September 25, equipment makers ASM, ASMPT and KLA said next-generation advanced packaging challenges now extend beyond individual tool performance to hybrid bonding and system integration.

• ASM, ASMPT and KLA spoke at Innovate Together 2026 in Singapore on September 25
• HBM stacks are moving beyond the 16-layer threshold
• Hybrid bonding, not single tools, is the main challenge
• Packaging is shifting toward system integration