Interview: Advanced packaging shifts toward system-level co-design for AI

Shin-Pu Jen, president of IMAPS Taiwan, said that in 2026 advanced semiconductor packaging is shifting from individual technologies to system-level co-design for AI tasks. In Taiwan, co-packaged optics, chiplets, and glass substrates are increasingly used.

• Chip packaging moves to system-level co-design for AI
• Key 2026 technologies: CPO, chiplets, and glass substrates
• Taiwan remains a center for advanced semiconductor packaging