One material, two transistor types: 'universal charge injector' points toward densely stacked AI chips

A KAIST team used a single material for efficient charge injection into atomically thin semiconductors. The technology could enable vertical integration of ultrathin layers, increasing density and energy efficiency of future AI chips.

• One material solves charge injection in atomically thin semiconductors
• Approach applies to two transistor types simultaneously
• Technology targets vertical layer stacking to boost chip density