TSMC and GlobalFoundries sign US interposer deal for CoWoS packaging

TSMC and GlobalFoundries have reached a manufacturing agreement to establish a US-based source of silicon interposers for TSMC's CoWoS advanced packaging ecosystem. The move aims to strengthen the American supply chain for AI accelerators and HBM memory.

• GF will produce interposers for TSMC's CoWoS packaging in the US
• Deal targets localization of the AI chip and HBM supply chain
• CoWoS remains a bottleneck for Nvidia accelerators and custom ASICs
• TSMC locked in 3–6% wafer price hikes for 2027