Samsung steps up HBM cooling as TSMC expands CoWoS

Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management challenges. Meanwhile TSMC is expanding CoWoS capacity, with its 3nm and 2nm nodes staying tight.

• Samsung extends HBM cooling beyond the memory stack itself
• Driven by larger chip packages and harder heat dissipation
• TSMC is expanding CoWoS packaging capacity
• TSMC 3nm and 2nm nodes remain in tight supply