IC-Link Joins TSMC 3DFabric Alliance, Showcases CoWoS Co-Design at OIP Forum

Imec's commercial chip division IC-Link joined TSMC's 3DFabric Alliance in May 2026, gaining certified co-design access to CoWoS, SoIC and InFO advanced packaging. It becomes the first European ASIC partner to hold all three TSMC OIP memberships and is presenting CoWoS sessions at the OIP Forum in Santa Clara.

• IC-Link is the first European ASIC partner with all three TSMC OIP memberships
• Supports CoWoS, SoIC, InFO and TSMC-SoW with physical design down to N2
• TSMC is scaling CoWoS output from 75–80K to 120–140K wafers per month
• SoIC hybrid bonding pitch is 9µm, with a roadmap to 3µm by 2027