Behind CoWoS: how a 0% yield crisis led to TSMC's first advanced packaging win

Former longtime TSMC advanced packaging executive Dr. Shin-Puu Jeng, now IMAPS chairman, recounted on the DIGITIMES podcast how an early 0% yield crisis led to the development of CoWoS. TSMC's 3nm, 2nm and CoWoS capacity remains tight, while Google's TPU investment pays back within a year.

• Jeng led advanced packaging development at TSMC and now chairs IMAPS
• Early CoWoS development was marked by a 0% yield crisis
• TSMC's 3nm, 2nm and CoWoS capacity remains tight
• Google's TPU investment pays back in one year, boosting MediaTek and Broadcom