BOE Completes Glass Core Substrate Qualification, Ships Samples for Chip-Level Testing

BOE has completed production-line qualification for its glass core substrate carrier boards and begun shipping samples to customers for chip-level electrical testing. The company has invested CNY 1.38 billion (~$206 million) in the project; a decision on larger production is targeted for the first half of 2027, with full-scale output possible by 2028.

• Substrates exceed 100×100 mm and passed full-line pull-through: TGV drilling, copper plating, ABF build-up
• Total investment reached CNY 1.38 billion: CNY 390 million in 2022 and CNY 993 million in 2024
• Samples are being tested with real CPUs and GPUs mounted in servers, the key qualification gate
• A decision on larger production investment is targeted for the first half of 2027