TetraMem tapes out 12nm analog in-memory computing chip

TetraMem has completed tapeout of the MLX300, a 12nm analog in-memory computing SoC built on multi-level RRAM. Developed with Synopsys EDA tools via Synopsys Cloud FlexEDA, the chip targets energy efficiency above 50 TOPS/W.

• MLX300 holds up to 64 million INT4 parameters on-chip without external DRAM
• Claimed energy efficiency exceeds 50 TOPS/W
• Prior MLX200/MLX200M taped out in 2026 on a 22nm process
• Targets audio, vision and smaller language models