Lam and Imec partner on 3D integration and High-NA EUV

Lam Research and Imec are collaborating to accelerate manufacturing readiness for 3D integration and advanced packaging. Joint research covers thick dielectric deposition, plasma dicing, new 3D memory materials and Lam's Aether dry resist for High-NA EUV. The work has already achieved 100% electrical yield for ruthenium direct metal etch interconnects at 20nm pitch.

• Partnership aims to speed 3D integration and advanced packaging into high-volume manufacturing
• Research covers dielectric deposition, plasma dicing and new 3D memory materials
• 100% electrical yield achieved for fork structures at 20nm ruthenium etch pitch
• Aether dry resist to be tested for High-NA EUV and interconnects