Madhya Pradesh bets $655M on India's first 3D AI chip packaging plant

Paras Semiconductors signed an MoU with Madhya Pradesh authorities for a ₹6,200 crore ($655 million) greenfield facility on 50 acres in the Indore–Ujjain corridor. The plant will target 2.5D/3D advanced IC packaging — the same category as TSMC's CoWoS — while India's operating OSAT plants in Gujarat still use legacy wire-bonding processes.

• The ₹6,200 crore ($655 million) project will span 50 acres
• The summit announced ₹15,800 crore ($1.67 billion) in total investment
• The facility targets 2.5D/3D packaging and heterogeneous integration
• India's operating OSAT plants in Sanand use legacy packaging