China's AI chipmakers pivot to 3D packaging, optical interconnects

China's domestic AI chipmakers are shifting their competitive focus from individual GPU performance to system-level integration, including 3D packaging, optical interconnects and proprietary software ecosystems. The shift is driven by increasingly complex AI models that demand system-scale scaling rather than single accelerators.

• Focus shifts from single GPUs to system-level integration
• Bet on 3D packaging and optical interconnects
• Companies build their own software ecosystems
• Driver is growing complexity of AI models