Hardware1 hOctober 14, 2026, 15:38

ASE expands PowerSiP with 3D packaging for AI data center VRMs

ASE has expanded its PowerSiP platform with a 3D system-in-package solution for vertical voltage regulator modules (VRMs) used in AI data centers and high-performance computing systems. The move targets better power efficiency for AI accelerators.

Digitimes

Open source

ASE expands PowerSiP with 3D packaging for AI data center VRMs

ASE expanded PowerSiP with a 3D system-in-package solution
Targets vertical VRMs for AI data centers
Platform also aimed at HPC systems
Goal is better power efficiency for AI chips

#ASE#PowerSiP

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