Zhen Ding unit breaks ground on $1.79B AI packaging substrate plant in Shenzhen

Leading Interconnect Semiconductor, a subsidiary of Zhen Ding Technology, has started construction of an advanced packaging substrate plant for AI in Bao'an, Shenzhen. Total investment is expected to reach at least CNY12 billion (about US$1.79 billion).

• Project run by Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary
• Site located in Bao'an district of Shenzhen
• Investment expected to be at least CNY12 billion (US$1.79 billion)
• Plant will produce advanced packaging substrates for AI