High-end ASIC demand accelerates TGV glass substrate adoption

Growing demand for high-end ASICs is pushing chipmakers toward through-glass via (TGV) substrates as copper-clad laminates hit signal transmission and thickness limits. Taiwan's TPK is weighing further expansion of its Taiwan capacity.

• Copper-clad laminates face signal and thickness limits
• ASIC demand accelerates TGV glass substrate adoption
• TPK weighs further expansion in Taiwan