Glass substrates, TGV set to reshape 2027 advanced packaging race

According to Digitimes, growing sizes of AI chip packages are pushing advanced packaging to a new level: in 2027, the market will be reshaped by glass substrates and through-glass via (TGV) technology.

• Glass substrates and TGV will become key in chip packaging by 2027
• Driven by growing sizes of AI chip packages
• Technology replaces traditional substrates