Onsemi Replaces PCB Substrate With Silicon Wafer, Boosting Power Density Up to 5x

Onsemi unveiled its Embedded Power Platform (EPP), which uses a 12-inch silicon wafer as the package substrate instead of a traditional PCB. The approach delivers up to 3–5x higher power density, 15% lower power losses, and 50% smaller solid-state circuit breakers for AI data centers. Subaru is the first announced partner for EVs.

• EPP uses a 12-inch silicon wafer as substrate instead of PCB
• Up to 3–5x higher power density and 15% lower losses
• Data center solid-state breaker is 50% smaller and 20% cooler
• Subaru is first partner; EPP samples expected this year