Hardware2 hOctober 20, 2026, 10:07

TPK targets 2028 TGV mass production with NT$6 billion investment

TPK Holding has completed a pilot line for through-glass via (TGV) substrate technology at its Zhongli plant and begun joint development and validation of early samples with semiconductor packaging companies. Mass production is targeted for 2028 under a NT$6 billion investment.

Digitimes

Open source

TPK targets 2028 TGV mass production with NT$6 billion investment

Pilot TGV line completed at TPK's Zhongli plant
Investment in the technology totals NT$6 billion
Mass production of glass substrates targeted for 2028
Samples are being validated with packaging partners

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