Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant

Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026 — the country's first capable of producing high-end flip chip ball grid array (FC-BGA) substrates.

• AST is a joint venture of Toppan Holdings and Broadcom
• Plant opened in Singapore on September 29, 2026
• First high-end FC-BGA substrate production in the country