SK hynix Discusses Mass Production of iHBM Memory With 30% Better Heat Resistance

SK hynix has begun talks with materials and equipment suppliers about mass production of its next-generation iHBM memory. The design embeds integrated cooling elements (ICE) in the die-to-die physical layer, cutting thermal resistance by about 30%. The company plans to use iHBM in HBM5 chips after HBM4.

• iHBM cuts HBM stack thermal resistance by about 30%
• ICE cooling elements are embedded in the D2D PHY layer
• The technology is planned for HBM5 memory
• iHBM will use the existing MR-MUF packaging process