Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup
South Korea's Hanmi Semiconductor showcased its HBM and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for HBM4 production. The Wide TC Bonder is scheduled to launch in 2027.
- Hanmi unveiled the TC Bonder 4 for HBM4 production
- Wide TC Bonder is set to launch in 2027
- Equipment was shown at SEDEX 2026
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