Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging

Hanmi Semiconductor said on September 22 it shipped its first FC Bonder 75 to a customer. The tool expands the South Korean equipment maker beyond HBM into the broader system semiconductor packaging market, including 2.5D packaging.

• Hanmi Semiconductor shipped its first FC Bonder 75 on September 22
• The tool targets 2.5D chip packaging
• The company moves beyond HBM into system semiconductor packaging