Hanmi showcases HBM4 TC Bonder 4 at SEMICON West 2026

Hanmi Semiconductor, which holds roughly 90% of the global HBM thermal compression bonder market, is showing its HBM4-rated TC Bonder 4, five 2.5D packaging tools and a Wide TC Bonder preview for HBM5/HBM6 at SEMICON West 2026. SK hynix ordered the TC Bonder 4.5 Griffin in a 44.2 billion won (~$31.8 million) deal covering about 15 units.

• Hanmi holds about 90% of the global HBM TC bonder market
• SK hynix ordered ~15 TC Bonder 4.5 Griffin units for $31.8 million
• TC Bonder 4 handles HBM4 stacks of up to 16 DRAM dies
• Wide TC Bonder for HBM5 and HBM6 ships to customers from 2027