Samsung Electro-Mechanics Completes Glass Substrate Reliability Tests, Starts Package Verification

Samsung Electro-Mechanics has finished reliability verification of its 100×100 mm glass substrate and moved to package-level testing with client chips. The company targets operating a glass substrate production line by the end of 2027; the substrate is over 60% larger in area than Nvidia's Blackwell GPU package substrate.

• 100×100 mm substrate with over 20 circuit layers and 80+ embedded IPDs
• Over 60% larger area than Nvidia Blackwell package substrate (81.5×74.8 mm)
• Production line targeted for launch by end of 2027
• Signed 290 billion won AI server MLCC contract; ~3.9 trillion won total this year