ASML patents point to hybrid bonder as chip toolmakers crowd into packaging

ASML appears to be preparing its second move into advanced packaging, with patents pointing to a hybrid bonder. Packaging equipment is becoming a new growth driver as transistor shrinking gets harder and costlier.

• ASML patents point to a hybrid bonder for advanced chip packaging
• Advanced packaging has become a new growth driver for chip equipment makers
• Shrinking transistors is getting harder and costlier, pushing focus to packaging