Intel patents MicroLEDs embedded in chip packaging

Intel has been granted a U.S. patent for embedding MicroLEDs into glass chip packaging, connected via through-glass vias for power and signal. The design could serve diagnostics, surface lighting and optical interconnects, overlapping with AU Optronics' MicroLED work.

• MicroLEDs sit in a glass substrate linked by copper-filled TGVs
• Diodes emit RGB light for diagnostics and package lighting
• Patent covers horizontal and vertical die layouts plus reflectors
• AU Optronics targets MicroLED optical links up to 10 m for AI data centers