Intel Malaysia expands advanced packaging in Penang for AI chips

Intel is expanding advanced packaging capacity in Malaysia, with a new Penang facility set to begin operations this year to support end-to-end assembly of complex AI chips. The company is developing EMIB-T, glass substrates and larger heterogeneous packages, and is hiring engineers who combine semiconductor expertise with data science and AI.

• New Intel advanced packaging facility in Penang starts operations this year
• Intel is developing EMIB-T, glass substrates and larger chiplet packages
• Company seeks engineers blending semiconductor, data and AI skills
• Intel partners with Malaysian universities on packaging and AI training