Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking

China's largest chip equipment makers are acquiring hybrid bonding technology, an advanced packaging step also pursued by global players from Besi to ASML. Huawei is looking beyond transistor shrinking for further gains.

• Chinese equipment vendors are buying into hybrid bonding technology
• Besi, ASML and other global players are chasing the same step
• Huawei seeks alternatives to further transistor shrinking