SK hynix Reportedly Trails Samsung in HBM Hybrid Bonding

An engineer at SK hynix's future technology research institute said the company is struggling to develop hybrid bonding for its HBM memory and has yet to produce samples. Samsung has reportedly already shipped hybrid-bonded HBM samples to customers.

• SK hynix has not yet begun producing hybrid-bonded HBM samples
• Samsung has reportedly sent hybrid-bonded HBM samples to customers
• Hybrid bonding fuses copper interconnects directly, removing solder bumps
• The delay risks SK hynix's leading HBM market share by revenue