Packaging-to-board integration emerges as key gap for AI electronics

Packaging, substrate, PCB and assembly makers need closer coordination to meet AI and HPC demands, as package-to-board integration becomes a growing technical bottleneck, industry executives said at a conference.

• Package-to-board integration named a key technical gap for AI and HPC
• Packaging, substrate, PCB and assembly makers need closer coordination
• The issue was discussed by industry executives at a conference