Daeduck Electronics targets 2029 ceramic substrates for AI packaging
South Korea's Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to tackle warpage and thermal management as AI chip packages grow larger. The company aims for volume production by 2029.
- Daeduck is developing ceramic core substrates for AI packaging
- Volume production targeted for 2029
- Technology addresses warpage and heat in large AI chips
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