Samsung, SK Hynix unveil zHBM and HBF to ease AI memory bottlenecks

At SEDEX 2026 in Seoul, Samsung and SK Hynix presented new memory architectures for AI systems. Samsung showed zHBM stacking HBM directly above the GPU, while SK Hynix is advancing NAND-based HBF with roughly 10x HBM capacity and about half its bandwidth.

• Samsung zHBM stacks HBM vertically above the GPU to shorten data paths
• SK Hynix HBF targets about 10x HBM capacity at half the bandwidth
• HBF standardization with Sandisk aims for final specs in January 2027
• Samsung showed HBM4E on a 4nm base die and 2.3D Cube-E packaging