Hardware2 hOctober 15, 2026, 13:46

SK Hynix targets January 2027 for HBF standard, eyes DRAM stacked on AI chips

SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027. The memory technology targets bottlenecks in AI inference systems by stacking DRAM on top of AI chips.

Digitimes

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SK Hynix targets January 2027 for HBF standard, eyes DRAM stacked on AI chips

HBF standard specifications targeted for January 2027
HBF is being developed to ease AI inference bottlenecks
The technology stacks DRAM on top of AI chips

#SKHynix#HBF#DRAM

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SK Hynix targets January 2027 for HBF standard, eyes DRAM stacked on AI chips

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CXMT's server DRAM push raises margin concerns for Samsung, SK Hynix

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