Memory bottlenecks push GPU makers toward 8-layer HBM stacks

As AI demand widens the gap between memory supply and demand, major GPU and custom ASIC vendors are considering lower-spec HBM configurations, including 8-layer stacks, for their next-generation chips, supply chain sources say.

• GPU and ASIC vendors weigh 8-layer HBM over higher-capacity stacks
• Driving factor is a growing memory shortage amid AI demand
• The shift would affect next-generation chips