Embedded dielectric chip cooling hits 1,570 W/cm² heat flux

Researchers at Peking University developed an embedded cooling system that uses the dielectric fluid HFE-7100 to remove heat from chips. Microchannels are etched into the chip substrate, with horizontal inlets feeding liquid and vertical outlets venting vapor. Initial tests reached a critical heat flux of 1,570 W/cm², versus under 1,000 W/cm² for earlier dielectric approaches.

• Critical heat flux reached 1,570 W/cm² in initial tests
• Dielectric HFE-7100 lowers short-circuit risk
• Horizontal inlets and vertical outlets speed vapor removal
• Design is compatible with standard semiconductor processes