Yole: advanced packaging to lift Malaysia up the chip value chain

Yole analyst Nur Hilwani says Malaysia is shifting from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years as AI reshapes demand.

• Malaysia is moving from assembly and testing toward advanced chip packaging
• Growth in the segment is expected over the next 2–3 years
• The driver is rising demand for AI chips
• The forecast comes from Yole analyst Nur Hilwani