Singapore bets on advanced packaging and silicon photonics in chip race

Amid the restructuring of global semiconductor supply chains, Singapore is focusing on advanced packaging, heterogeneous integration, silicon photonics and optical interconnects, leveraging nearly six decades of manufacturing experience.

• Singapore prioritizes advanced packaging and heterogeneous integration
• Focus areas include silicon photonics and optical interconnects
• The country draws on nearly 60 years of manufacturing
• Bet is on critical and mature technologies