GlobalFoundries signs $2bn five-year deal with TSMC for advanced packaging

GlobalFoundries will supply TSMC with silicon interposers for its CoWoS advanced packaging ecosystem from its Malta, New York fab. The $2 billion agreement runs five years, with volume production expected to ramp in the first half of 2028.

• The $2bn deal has an initial five-year term with room for expansion
• Malta fab becomes the first US source of silicon interposers
• Volume production is expected to begin in H1 2028
• Interposers with TSVs enable 3D stacking for AI chips