TSMC Plans Five More Advanced Packaging Plants in Taiwan

TSMC is reportedly pushing to build five additional advanced packaging plants at the Chiayi Science Park in southern Taiwan, bringing its total there to 10. The expansion targets soaring CoWoS demand from Nvidia, AMD and Apple, with capex for the year raised to $60–64 billion.

• Chiayi park would host 10 TSMC packaging plants, the world's largest hub
• Plants P3–P5 on the Phase 2 site are targeted for completion by 2031
• TSMC raised 2026 capex from $52–56 billion to $60–64 billion
• CoWoS bonds AI chips with HBM memory; demand outstrips supply